27 Aug '14, 4pm

Intel Announces New Packaging and Test Technologies for Foundry Customers

New Technologies to Improve Time to Market and Reduce Costs SANTA CLARA, Calif., Aug. 27, 2014 – Intel Corporation today announced two new technologies for Intel Custom Foundry customers that need cost-effective advanced packaging and test technologies. Embedded Multi-die Interconnect Bridge (EMIB), available to 14nm foundry customers, is a breakthrough that enables a lower cost and simpler 2.5D packaging approach for very high density interconnects between heterogeneous dies on a single package. Instead of an expensive silicon interposer with TSV (through silicon via), a small silicon bridge chip is embedded in the package, enabling very high density die-to-die connections only where needed. Standard flip-chip assembly is used for robust power delivery and to connect high-speed signals directly from chip to the package substrate. EMIB eliminates the need for TSVs and spec...

Full article: http://newsroom.intel.com/community/intel_newsroom/blog/2...

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